| Fine Pitch Die-to-Wafer Hybrid Bonding | 3DIC / Advanced Packaging | 2023 | Article |
 | Analysis of Die Edge Bond Pads in Hybrid Bonded Multi-Die Stacks | 3DIC / Nanotechnology | 2022 | Article |
 | HVM CMP Process Development for Advanced Direct Bond Interconnect (DBI) | 3DIC / Nanotechnology | 2022 | Article |
 | Die to Wafer Hybrid Bonding for Chiplet and Heterogeneous Integration: Die Size Effects Evaluation-Small Die Applications | 3DIC / Nanotechnology | 2022 | Article |
 | Die to Wafer Hybrid Bonding and Fine Pitch Considerations | 3DIC / Nanotechnology | 2021 | Article |
 | Low Temperature Hybrid Bonding for Die to Wafer Stacking Applications | 3DIC / Nanotechnology | 2021 | Article |
 | Die to Wafer Stacking with Low Temperature Hybrid Bonding | 3DIC / Nanotechnology | 2020 | Article |
 | Development of Low Temperature Direct Bond Interconnect Technology for Die-To-Wafer and Die-To-Die Applications-Stacking, Yield Improvement, Reliability Assessment | 3DIC / Nanotechnology | 2018 | Article |
 | Spectroscopic ellipsometry and photoluminescence measurements of as-deposited and annealed silicon rich oxynitride films | Nanotechnology | 2008 | Article |
 | Nanocrystal formation in annealed a- SiO17N0.07:H films | Nanotechnology | 2003 | Article |
 | Effects of process parameters on PECVD silicon-oxide and aluminum oxide barrier films | DIffusion Barriers | 1995 | Article |
 | Preparation and properties of SiO2– SiOx heterostructures formed by uninterrupted processing by remote plasma enhanced chemical vapor deposition | Remote PECVD | 1990 | Article |
 | Performance of a-SiH Photodiode Technology-Based Advanced CMOS Active Pixel Sensor Imagers | CMOS Image Sensors | 2001 | Article |
 | Mid-gap states measurements of low-level boron-doped a-SiH Films | CMOS Image Sensors | 2000 | Article |
 | a-SiH photodiode technology for advanced CMOS active pixel sensor imagers | CMOS Image Sensors | 2002 | Article |
 | The carbon content of silicon sub-oxide films deposited by room temperature PECVD of hexamethyldisiloxane and oxygen | Diffusion Barriers | 1994 | Article |
 | The effect of NH3, N2 and excitation frequency on the reaction chemistry for Si3N4 thin film growth by remote plasma enhanced chemical vapor deposition | Remote PECVD | 1992 | Article |
 | Hydrogenated Amorphous Silicon Photodiode Technology for Advanced CMOS Active Pixel Sensor Imagers | CMOS Image Sensors | 2000 | Article |
 | The Effect of Thermal Cycling on a-CF,H Low Dielectric Constant Films Deposited by ECR Plasma Enhanced Chemical Vapor Deposition | Low-k Dielectrics | 1998 | Article |
 | Thermal Stability of a-C:F,H Films Deposited by Electron Cyclotron Resonance Plasma Enhanced Chemical Vapor Deposition | Low-k Dielectrics | 1997 | Article |
 | Studies of SiH2Cl2 Gas Phase Chemistry for Selective Thin FIlm Growth of Crystalline Silicon, c-Si, Using Remote Plasma Enhanced Chemical Vapor Deposition | Remote PECVD | 1991 | Article |
 | Local bonding environments of SiOH groups in SiO2 incorporated during deposition by remote PECVD, and incorporated by post- deposition exposure to water vapor | Remote PECVD | 1990 | Article |
 | Reduction of residual transient photocurrents in a-SiH elevated photodiode array based CMOS image sensors | CMOS Image Sensors | 2005 | Article |
 | Suppression of Staebler-Wronski Effect Induced Electrical Crosstalk in a-Si H-Based Image Sensors | CMOS Image Sensors | 2004 | Article |
 | REVIEW ARTICLE: Advances in elevated diode technologies for integrated circuits progress towards monolithic instruments | CMOS Image Sensors | 2003 | Review Article |
 | Leakage Current Behavior in Common i‐layer a‐Si:H p‐i‐n Photodiode Arrays | CMOS Image Sensors | 2003 | Article |
 | REVIEW ARTICLE: Fluorinated amorphous carbon films for low permittivity interlevel dielectrics | Low-k Dielectrics | 1999 | Review Article |
| Sticking probability studies of SiO2 and polymerized siloxane thin films by plasma enhanced chemical vapor deposition | Diffusion Barriers | 1995 | Article |
 | Gas distribution through injection manifolds in vacuum systems | Remote PECVD | 1995 | Article |
 | Deep trench fabrication by Si (110) orientation dependent etching | Diffusion Barriers | 1995 | Article |
| A complete approach to the in-line monitoring of materials defects introduced in dielectric and Si by plasma proce | PECVD | 1997 | Article |
 | Surface Photovoltage Measurements and Contact Potential Difference Imaging of Defects Introduced by Plasma Processing | PECVD | 1996 | Article |
 | Electron and hole drift mobility measurements on thin film CdTe solar cells | Photovoltaics | 2014 | Article |
 | Deposition of vanadium oxide films by direct-current magnetron reactive sputtering | Reactive Sputtering | 1988 | Article |
 | Effects of microstructure and nonstoichiometry on electrial properties of vanadium dioxide films | Reactive Sputtering | 1989 | Article |
 | Chemical, optical, vibrational and luminescent properties of hydrogenated silicon-rich oxynitride films | Nanotechnology | 2005 | Article |
 | Nanocrystal formation in annealed a-SiO 0.17N 0.07H films | Nanotechnology | 2004 | Article |
 | Nanocrystal formation in thermally oxidized and annealed a-SiH films and SiOxNy films (x = 0.17 y = 0.07) | Nanotechnology | 2003 | Article |
 | Fabrication and characterization of silicon nanocrystals by thermal oxidation of a-SiH films in air | Nanotechnology | 2003 | Article |
 | Characterization of a Dipole Surface Drive Actuator With Large Travel and Force | MEMS | 2006 | Article |
 | XGA resolution full video microdisplay using light emitting polymers on a silicon active matrix circuit | Microdisplays | 2001 | Article |
 | Formation of Multilayer SiO2-SiOx Heterostructures by Control of Reaction Pathways in Remote PECVD | Remote PECVD | 1990 | Article |
 | Reaction Pathways and Sources of OH groups in Low Temperature Remote PECVD SIlicon DIoxide Thin FIlms | Remote PECVD | 1989 | Article |
| The effect of NH3, N2 and excitation frequency on the reaction chemistry for Si3N4 thin film growth by remote plasma enhanced chemical vapor deposition | Remote PECVD | 1992 | Article |
 | Vanadium reactive magnetron sputtering in mixed Ar-O2 discharges | Reactive Sputtering | 1997 | Article |
 | Elevated Photodiode Arrays | CMOS Sensors | 2010 | Lecture |
 | Introduction to Photovoltaics Manufacturing Technology | Photovoltaics | 2012 | Lecture |
 | Water | Desalination | 2015 | Lecture |
 | Water Deficits and Opportunities in the United States | Desalination | 2015 | Poster |
 | Water: Water Sources, and Opportunities for Solar | Desalination | 2016 | Lecture |
 | Effects of Deposition Parameters on Thin Film Properties of Silicon-Based Electronic Materials Deposited by Remote Plasma- Ph.D. NCSU | Remote PECVD | 1992 | Thesis |
 | Reactive Magnetron Sputtering of VO2 Films- M.S. UIUC | Reactive Sputtering | 1988 | Thesis |
 | Developing an Enduring Manufacturing Infrastructure | Manufacturing | 2017 | Whitepaper |
| Recent Developments in Fine Pitch Wafer-to-Wafer Hybrid Bonding with Copper Interconnect | 3DIC / Nanotechnology | 2019 | Article |
| Chip to Wafer Hybrid Bonding with Cu Interconnect: High Volume Manufacturing Process Compatibility Study | 3DIC / Nanotechnology | 2019 | Article |
| Nanoscale Topography Characterization for Direct Bond Interconnect | Nanotechnology | 2019 | Article |
| Low Temperature Cu Interconnect with Chip to Wafer Hybrid Bonding | 3DIC / Nanotechnology | 2019 | Article |
 | Materials science community support for teaching sustainability | Clean Energy / Sustainability | 2021 | Article |
