J. A. Theil, T. Workman, D. Suwito, L. Mirkarimi, G. Fountain, KM Bang, G. Gao, B. Lee, P. Mrozek, C. Uzoh, M. Huynh, and O. Zhao, “Analysis of Die Edge Bond Pads in Hybrid Bonded Multi-Die Stacks“, 72nd Electronic Components and Technology Conference, (2022).
L. Mirkarimi, C. Uzoh, D. Suwito, G. Fountain, T. Workman, B. Lee, J. Theil, G. Gao, “The Influence of Microstructure on Thermal Budget in Hybrid Bonding”, 72nd Electronic Components and Technology Conference, (2022).
T. Workman, L. Mirakarimi, J. Theil, G. Fountain, KM Bang, B. Lee, C. Uzoh, D. Suwito, G. Gao, and P. Mrozek, “Die to Wafer Hybrid Bonding and Fine Pitch Considerations“, Proceedings of the 71st Electronic Components and Technology Conference, (2021).
G. Gao, L. Mirkarimi, G. Fountain, T. Workman, J. Theil, G. Guevara, C. Uzoh, D. Suwito, B. Lee, K. M. Bang, R. Katkar, “Die to Wafer Stacking with Low Temperature Hybrid Bonding”, Electronic Components and Technology Conference, (2020).
G. Gao, L. Mirkarimi, C. Rudolph, T. Werner, A. Hanisch, T. Workman, G. Fountain, J. Theil, G. Guevara, P. Liu, and B. Lee, “Low-Temperature Cu Interconnect with Chip-to-Wafer Hybrid Bonding”, 69th IEEE Electronic Components and Technology Conference Proceedings, (2019).
Sandeep Kohli, Jeremy A. Theil, Patricia C Dippo, KM Jones, Mowafak M. Al-Jassim , Richard K. Ahrenkiel, Christopher D. Rithner, and Peter K. Dorhout, “Nanocrystal formation in annealed a- SiO17N0.07:H films”, Nanotechnology, 15, 1831-1836 (2004).
Jeremy A. Theil, T. Workman, D. Suwito, L. Mirkarimi, G. Fountain, KM Bang, G. Gao, B. Lee, P. Mrozek, C. Uzoh, M. Huynh, and O. Zhao, “Analysis of Die Edge Bond Pads in Hybrid Bonded Multi-Die Stacks, 72nd Electronic Components and Technology Conference, (2022).
Jeremy Theil, L. Mirkarimi, G. Fountain, G. Gao, and R. Katkar, “Recent Developments in Fine Pitch Wafer-to-Wafer Hybrid Bonding with Copper Interconnect”, 2019 International Wafer Level Packaging, Conference (IWLPC).
North Carolina State University, Raleigh, NC, “Uses and limitations of molecular models for vibrational mode calculations in amorphous materials”, May 1990.
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US6016011, EP1049158 Method and apparatus for a dual-inlaid damascene contact to sensor. (Assignee: Hewlett-Packard Company, January 18, 2000).
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An improved biasing connection for an array of photodiodes.
Isolation of a‐Si:H by CMP using dielectric as barriers.
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US7152758 Scented material dispense system for a hand-held device. (Assignee: Avago Technologies, December 26, 2006).
R. W. Knoll, and J. A. Theil, “Use of a Liquid in Plasma Treatment of the Surface of a Container”, 1993.
J. A. Theil, “Method for Determining Permeability, Diffusion Coefficient, and Solubility Using Transient Permeation Data.”, 1993.
J. A. Theil, “Plasma Electrode Configuration for Enabling Thin Film Coatings on Three Dimensional Objects.”, 1992. Filed.